University have introduced an innovative method—microelectrothermoforming (μETF)—to create flexible neural interfaces with microscopic three-dimensional (3D) structures. Their findings show how this method improves neural recording and stimulation, with potential applications in artificial retina devices and brain-computer interfaces.

The μETF method involves heating a thin, flexible polymer sheet embedded with microelectrodes and pressing it against a 3D-printed mold. The researchers used liquid crystal polymer (LCP) as the substrate due to its mechanical strength, biocompatibility, and long-term stability. This process forms precise protruding and recessed structures, enhancing the electrode's proximity to target neurons while preserving its electrical properties. Unlike traditional micromachining approaches, μETF simplifies fabrication and allows for a wide range of complex 3D structures, including wells, domes, walls, and triangular features, all within a single MEA.

The versatility of μETF extends beyond neural interfaces. The research team is exploring its potential in wearable electronics, organoid studies, and lab-on-a-chip systems, where precise 3D microstructures could enhance device functionality. The next step includes refining fabrication techniques for broader medical applications.

With its ability to enhance neural recording and stimulation while simplifying fabrication, μETF represents a major advancement in neuroprosthetic technology and neural rehabilitation treatments.

- Authors (Pusan National University) 

· First authors: Dong Hyeon Lee (School of Mechanical Engineering), Younghoon Park (Department of Electronics Engineering)

· Corresponding authors: Kyungsik Eom (Department of Electronics Engineering), Joonsoo Jeong (Department of Information Convergence Engineering)

- Title of original paper: Microelectrothermoforming (μETF): one-step versatile 3D shaping of flexible microelectronics for enhanced neural interfaces

- Journal: npj Flexible Electronics

- Web link: https://www.nature.com/articles/s41528-024-00378-0 

- Contact e-mail: joonsoo_jeong@pusan.ac.kr, kseom@pusan.ac.kr